Companies · TSM
Taiwan Semiconductor Manufacturing
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Latest analysis
Updated Aug 25, 2026
TSMC reports July 2026 bond issuance and minor executive share purchases; no material operational changes.
TSMC issued NT$18.5 billion in unsecured bonds across two tranches in July 2026 (NT$14.0 billion at 2.03% due 2031, NT$4.5 billion at 2.10% due 2036) and recorded NT$0.7 billion in equity investment dispositions. Two vice presidents increased personal shareholdings by 5,000 shares each. This Form 6-K contains no forward-looking statements, production updates, customer wins, or strategic commentary — it is a routine regulatory filing disclosing corporate governance and capital actions only.
Tone: neutralRevenue
TWD 3.8T
TSM 20-F · FY 2025 · TWD
Revenue growth YoY
+31.6%
Founded
1987
Headquarters
Hsinchu
Profile
TSM 20-F Item 4.B · Apr 16, 2026Taiwan Semiconductor Manufacturing Company (TSMC), founded in 1987, is the world's largest dedicated semiconductor foundry, manufacturing integrated circuits on behalf of customers who provide their own designs. The company operates across advanced and specialty process nodes from 2-nanometer to 0.35-micron, serving fabless IC companies, system companies, and integrated device manufacturers globally. Its principal platforms are High Performance Computing, Smartphones, IoT, Automotive, and Digital Consumer Electronics.
Read filing description ↓ Collapse description ↑
As a foundry, we manufacture semiconductors using our manufacturing processes for our customers based on proprietary integrated circuit designs provided by them. We offer a comprehensive range of wafer fabrication processes, including processes to manufacture complementary metal-oxide-semiconductor ('CMOS') logic, mixed-signal, radio frequency ('RF'), embedded memory, bipolar complementary metal-oxide-semiconductor ('BiCMOS', which uses CMOS transistors in conjunction with bipolar junction transistor) mixed-signal and others. We also offer design, mask making, TSMC 3DFabric® advanced silicon stacking and packaging services, and testing services. We believe that our scale and capacity, particularly for advanced technologies, is a major competitive advantage. We count among our customers many of the world's leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers. We currently operate one 150mm wafer fab, six 200mm wafer fabs, nine 300mm wafer fabs, and seven advanced backend fabs. Our 2-nanometer technology entered volume production in 2025. Also, the development of our 16-angstrom technology is on track, and its risk production is expected in 2026. We are entering a period of higher growth as the multiyear megatrends of 5G, AI and high performance computing are expected to fuel strong demand for our semiconductor technologies in the next several years.
Primary products
- CMOS logic wafer fabrication
- Mixed-signal wafer fabrication
- Radio frequency (RF) wafer fabrication
- Embedded memory wafer fabrication
- BiCMOS mixed-signal wafer fabrication
- TSMC 3DFabric® advanced silicon stacking and packaging services
End markets
Geographies
“We believe that we are the technology leader among the dedicated foundries in terms of our net revenue of advanced semiconductors of 7-nanometer and below and are one of the leaders in the semiconductor manufacturing industry for mainstream and specialty technologies.” Competitive position, as stated in the filing
Revenue commentary · FY 2025
Reported in NT$. Net revenue increased 31.6% in 2025 versus 2024, driven primarily by higher average selling prices from a greater mix of advanced technology (7-nanometer and below) revenue and an increase in wafer shipments, partially offset by NT dollar appreciation against the U.S. dollar.
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